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PCBA Board Assembly 03

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

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PCBA Board Assembly 02

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

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PCBA Board Assembly 01

Point Components type PCB size 246 70 130mm*110mm RLC Minimum Package Size Minimum device pin spacing Welding mode 0402 0.65 Reflow soldering for double sides+ Wave soldering Manufacturing process PCB producing+components procurement+assembly

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