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PCBA Board Assembly 19

PCBA Board Assembly 19

Point Components type PCB size 246 70 130mm*110mm RLC Minimum Package Size Minimum device pin spacing Welding mode 0402 0.65 Reflow soldering for double sides+ Wave soldering Manufacturing process PCB producing+components procurement+assembly

Product Details
PCBA Board Assembly 18

PCBA Board Assembly 18

Point Components type PCB size 246 70 130mm*110mm RLC Minimum Package Size Minimum device pin spacing Welding mode 0402 0.65 Reflow soldering for double sides+ Wave soldering Manufacturing process PCB producing+components procurement+assembly

Product Details
PCBA Board Assembly 17

PCBA Board Assembly 17

Point Components type PCB size 246 70 130mm*110mm RLC Minimum Package Size Minimum device pin spacing Welding mode 0402 0.65 Reflow soldering for double sides+ Wave soldering Manufacturing process PCB producing+components procurement+assembly

Product Details
PCBA Board Assembly 16

PCBA Board Assembly 16

Point Components type PCB size 246 70 130mm*110mm RLC Minimum Package Size Minimum device pin spacing Welding mode 0402 0.65 Reflow soldering for double sides+ Wave soldering Manufacturing process PCB producing+components procurement+assembly

Product Details
PCBA Board Assembly 15

PCBA Board Assembly 15

Point Components type PCB size 246 70 130mm*110mm RLC Minimum Package Size Minimum device pin spacing Welding mode 0402 0.65 Reflow soldering for double sides+ Wave soldering Manufacturing process PCB producing+components procurement+assembly

Product Details
PCBA Board Assembly 14

PCBA Board Assembly 14

Point Components type PCB size 246 70 130mm*110mm RLC Minimum Package Size Minimum device pin spacing Welding mode 0402 0.65 Reflow soldering for double sides+ Wave soldering Manufacturing process PCB producing+components procurement+assembly

Product Details
PCBA Board Assembly 13

PCBA Board Assembly 13

Point Components type PCB size 246 70 130mm*110mm RLC Minimum Package Size Minimum device pin spacing Welding mode 0402 0.65 Reflow soldering for double sides+ Wave soldering Manufacturing process PCB producing+components procurement+assembly

Product Details
PCBA Board Assembly 12

PCBA Board Assembly 12

Point Components type PCB size 246 70 130mm*110mm RLC Minimum Package Size Minimum device pin spacing Welding mode 0402 0.65 Reflow soldering for double sides+ Wave soldering Manufacturing process PCB producing+components procurement+assembly

Product Details
PCBA Board Assembly 11

PCBA Board Assembly 11

Point Components type PCB size 246 70 130mm*110mm RLC Minimum Package Size Minimum device pin spacing Welding mode 0402 0.65 Reflow soldering for double sides+ Wave soldering Manufacturing process PCB producing+components procurement+assembly

Product Details
PCBA Board Assembly 10

PCBA Board Assembly 10

Point Components type PCB size 246 70 130mm*110mm RLC Minimum Package Size Minimum device pin spacing Welding mode 0402 0.65 Reflow soldering for double sides+ Wave soldering Manufacturing process PCB producing+components procurement+assembly

Product Details
PCBA Board Assembly 09

PCBA Board Assembly 09

a2 Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surfac

Product Details
PCBA Board Assembly 08

PCBA Board Assembly 08

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

Product Details
PCBA Board Assembly 07

PCBA Board Assembly 07

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

Product Details
PCBA Board Assembly 06

PCBA Board Assembly 06

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

Product Details
PCBA Board Assembly 05

PCBA Board Assembly 05

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

Product Details
PCBA Board Assembly 04

PCBA Board Assembly 04

Product Details
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