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RF Antenna PCB

Discover our RF antenna PCB solutions, optimized for high-frequency performance in RF applications, ensuring reliable signal transmission and quality.

RF Antenna PCB

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RF Antenna PCB 44

RF Antenna PCB 44

Semiconductor Field Test Probe Card 36 layers 2+N+2 Board Thickness: 4.8 mm Minimum Hole Size: 0.2 mm Hole-to-Line Distance: 0.14 mm

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RF Antenna PCB 43

RF Antenna PCB 43

Semiconductor Field Test 16 layers 7-step HDI 7+N+7 HDI Thickness: 2.4 mm Minimum hole size: 0.15 mm Hole-to-line distance: 0.07 mm Minimum line width/distance: 0.055/0.055 mm Surface Finish: ENIG

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RF Antenna PCB 42

RF Antenna PCB 42

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

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RF Antenna PCB 41

RF Antenna PCB 41

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

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RF Antenna PCB 40

RF Antenna PCB 40

Step golden finger board Material: TU-872SLK 22 layers 1-step HDI 1+N+1 HDI Thickness: 3.0 mm Minimum hole size: 0.25 mm Hole-to-line distance: 0.13 mm Surface Finish: ENIG + Gold finger + Back drill

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RF Antenna PCB 39

RF Antenna PCB 39

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

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RF Antenna PCB 38

RF Antenna PCB 38

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

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RF Antenna PCB 37

RF Antenna PCB 37

Application: Computer Product Features: 2x Laser drilling, 3x Pressfit, 2-step HDI board Material: Shengyi S1000-2M Layers: 10L Board Thickness: 1.60.16mm Minimum Hole Size: Laser hole: 0.127mm; Mechanical hole: 0.20mm, Aspect ratio: 8:1 Minimum Line Widt

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RF Antenna PCB 36

RF Antenna PCB 36

Semiconductor Field Interposer 14 layers 4-step HDI 4+N+4 HDI Thickness: 2.6 mm Minimum hole size: 0.1 mm Hole-to-line distance: 0.1 mm Minimum line width/spacing: 0.06/0.09 mm

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RF Antenna PCB 35

RF Antenna PCB 35

Fixture Test Board 4 layers Surface Finish: ENIG Minimum Line Width/Spacing: 0.05/0.05 mm Impedance Tolerance: +/-8%

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RF Antenna PCB 34

RF Antenna PCB 34

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

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RF Antenna PCB 33

RF Antenna PCB 33

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

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RF Antenna PCB 32

RF Antenna PCB 32

High Speed Chip Server Card Material: TU-872SLK + RO4350 16 layers Board Thickness: 1.6 mm Minimum Line Width/Spacing: 0.075/0.075 mm Surface Finish: ENIG + Gold finger

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RF Antenna PCB 31

RF Antenna PCB 31

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

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RF Antenna PCB 30

RF Antenna PCB 30

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

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RF Antenna PCB 29

RF Antenna PCB 29

100G Optical Communication Module Material: R-5775G 10 layers 2-step HDI 2+N+2 HDI Surface Finish: Nickel plated palladium

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